{"id":2964,"date":"2021-09-08T13:49:46","date_gmt":"2021-09-08T05:49:46","guid":{"rendered":"https:\/\/uetpcb.com\/?p=2964"},"modified":"2022-05-09T14:17:30","modified_gmt":"2022-05-09T06:17:30","slug":"what-is-pcb-lamination-presses","status":"publish","type":"post","link":"https:\/\/uetpcb.com\/es\/what-is-pcb-lamination-presses\/","title":{"rendered":"Qu\u00e9 son las prensas de laminaci\u00f3n de PCB"},"content":{"rendered":"<div data-zone-id=\"0\" data-line-index=\"0\">Muchos clientes, debido a la falta de conocimiento sobre el proceso de prensado de laminaci\u00f3n de placas de circuito impreso (PCB), han sufrido numerosas p\u00e9rdidas: al recibir la placa multicapa, se han encontrado con deformaciones, una estratificaci\u00f3n evidente e incluso problemas graves de calidad, como circuitos abiertos en la capa interna. La raz\u00f3n principal es que algunas f\u00e1bricas no disponen de su propia l\u00ednea de prensado, por lo que este proceso solo puede subcontratarse a otras f\u00e1bricas; adem\u00e1s, muchas f\u00e1bricas OEM presentan numerosos defectos en los equipos y los procesos, lo que da lugar a una calidad de prensado incontrolable, como por ejemplo:<\/div>\n<div data-zone-id=\"0\" data-line-index=\"0\">\u25cfEl fabricante no dispone de una m\u00e1quina de termofusi\u00f3n ni de una m\u00e1quina de perforaci\u00f3n por rayos X. La precisi\u00f3n de posicionamiento entre capas se ve afectada por la tolerancia de los orificios de los remaches durante el proceso de remachado. El impacto que se produce durante el prensado de la laminaci\u00f3n de la placa de circuito impreso provocar\u00e1 la deformaci\u00f3n del remache, lo que dar\u00e1 lugar a una desviaci\u00f3n entre capas (esto obliga a que, cuanto mayor sea la distancia entre el orificio y la l\u00ednea, menor sea la tasa de desechos de la placa de alta precisi\u00f3n).<\/div>\n<div data-zone-id=\"0\" data-line-index=\"0\">\u25cfLa tasa de aver\u00edas de la m\u00e1quina de prensado para laminado de placas de circuito impreso de este fabricante es elevada, y la eficiencia productiva es baja debido a las aver\u00edas, lo que impide realizar las entregas a tiempo y afecta a la fecha de entrega.<\/div>\n<h2 class=\"okr-block-clipboard\" data-okr=\"%7B%22okrDelta%22%3A%5B%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22What%20is%20PCB%20Lamination%20Press%3F%22%2C%22bold%22%3Atrue%2C%22textcolor%22%3A%22rgba(36%2C91%2C219%2C1)%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22PCB%20lamination%20pressing%20is%20the%20use%20of%20high%20temperature%20and%20high%20pressure%20to%20make%20the%20semi-cured%20sheet%20heat%20melt%2C%20and%20make%20it%20flow%2C%20and%20then%20transformed%20into%20a%20cured%20sheet.%20The%20process%20of%20bonding%20one%20or%20more%20inner%20etched%20plates%20(blackened%20or%20browned)%20and%20copper%20foil%20into%20a%20multilayer%20PCB.%20%20This%20process%20also%20includes%20typesetting%20before%20pressing%2C%20drilling%20positioning%20holes%2C%20and%20shape%20machining%20of%20the%20laminated%20PCB%20after%20pressing.%22%7D%7D%5D%7D%5D%2C%22businessKey%22%3A%22lark-doc%22%7D\">\u00bfQu\u00e9 es una prensa de laminaci\u00f3n de placas de circuito impreso?<\/h2>\n<div data-zone-id=\"0\" data-line-index=\"1\">\n<div>El prensado de laminaci\u00f3n de placas de circuito impreso (PCB) consiste en utilizar altas temperaturas y altas presiones para que la l\u00e1mina semicurada se funda con el calor, fluya y, a continuaci\u00f3n, se transforme en una l\u00e1mina curada. Proceso que consiste en unir una o m\u00e1s placas internas grabadas (ennegrecidas o doradas) y l\u00e1mina de cobre para formar un PCB multicapa. Este proceso tambi\u00e9n incluye la composici\u00f3n antes del prensado, la perforaci\u00f3n de orificios de posicionamiento y el mecanizado de la forma del PCB laminado tras el prensado.<\/div>\n<\/div>\n<div class=\"row\"  id=\"row-270002812\">\n\n\t<div id=\"col-2065781465\" class=\"col medium-6 small-12 large-6\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_1742553409\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"600\" height=\"372\" src=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/1.jpg\" class=\"attachment-large size-large\" alt=\"Placa de circuito impreso\" srcset=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/1.jpg 600w, https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/1-300x186.jpg 300w\" sizes=\"(max-width: 600px) 100vw, 600px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_1742553409 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n<\/div>\n<h2 class=\"okr-block-clipboard\" data-okr=\"%7B%22okrDelta%22%3A%5B%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20Purpose%20of%20PCB%20Lamination%20Presses%22%2C%22bold%22%3Atrue%2C%22textcolor%22%3A%22rgba(36%2C91%2C219%2C1)%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20main%20purpose%20of%20PCB%20lamination%20pressing%20is%20to%20combine%20PP%20with%20a%20different%20inner%20layer%20and%20outer%20copper%20foil%2C%20through%20%5C%22heat%20and%20pressure%5C%22%2C%20and%20use%20the%20outer%20copper%20foil%20as%20the%20base%20of%20the%20outer%20circuit%2C%20different%20PP%20composition%20with%20a%20different%20inner%20layer%20and%20surface%20copper%20can%20be%20deployed%20out%20of%20different%20specifications%20of%20the%20thickness%20of%20the%20circuit%20board.%22%7D%7D%2C%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22%C2%A0%22%2C%22textcolor%22%3A%22rgba(31%2C35%2C41%2C1)%22%7D%7D%5D%7D%5D%2C%22businessKey%22%3A%22lark-doc%22%7D\">La finalidad de las prensas de laminaci\u00f3n de placas de circuito impreso<\/h2>\n<div data-zone-id=\"0\" data-line-index=\"1\">\n<div>El objetivo principal del prensado de laminaci\u00f3n de placas de circuito impreso (PCB) es combinar el PP con una capa interna diferente y una l\u00e1mina de cobre exterior, mediante \u201ccalor y presi\u00f3n\u201d, y utilizar la l\u00e1mina de cobre exterior como base del circuito exterior; as\u00ed, se pueden obtener placas de circuito impreso con diferentes especificaciones de grosor, utilizando diferentes composiciones de PP con distintas capas internas y capas de cobre superficiales.\u00a0<\/div>\n<\/div>\n<h2 class=\"okr-block-clipboard\" data-okr=\"%7B%22okrDelta%22%3A%5B%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20Process%20of%20PCB%20Lamination%20Presses%3F%22%2C%22bold%22%3Atrue%2C%22textcolor%22%3A%22rgba(36%2C91%2C219%2C1)%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%221%22%2C%22ol-id%22%3A%22nwuSxW8X%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Brown%20oxide%20Make%20the%20inner%20layer%20of%20copper%20and%20protective%20oxide%20layer%2C%20avoid%20PP%20and%20barrel%20surface%20direct%20contact%20chemical%20but%20poor%20morning%20pressing.%20%20%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%222%22%2C%22ol-id%22%3A%22nwuSxW8X%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Booking%22%7D%7D%5D%7D%5D%2C%22businessKey%22%3A%22lark-doc%22%7D\">\u00bfEn qu\u00e9 consiste el proceso de las prensas de laminaci\u00f3n de placas de circuito impreso?<\/h2>\n<ol>\n<li>\u00d3xido marr\u00f3n: forma la capa interna de cobre y la capa protectora de \u00f3xido; evita el contacto directo entre el PP y la superficie del cilindro, ya que, aunque es qu\u00edmico, la prensado matutino resulta deficiente.<\/li>\n<li>Reservas<\/li>\n<\/ol>\n<div class=\"row\"  id=\"row-52582678\">\n\n\t<div id=\"col-529777247\" class=\"col medium-6 small-12 large-6\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_2003888055\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"501\" height=\"586\" src=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/2.png\" class=\"attachment-large size-large\" alt=\"M\u00e1quina de circuitos impresos\" srcset=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/2.png 501w, https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/2-256x300.png 256w\" sizes=\"(max-width: 501px) 100vw, 501px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_2003888055 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n<\/div>\n<p>3. Laminado autom\u00e1tico: El material base de la placa de circuito impreso (PCB) precomprimido se prensa junto con la l\u00e1mina de cobre superior + placa de acero y la l\u00e1mina de cobre inferior + placa de acero mediante un dispositivo autom\u00e1tico de absorci\u00f3n y transferencia.<\/p>\n<p>4. Circulaci\u00f3n autom\u00e1tica<\/p>\n<div class=\"row\"  id=\"row-1681392491\">\n\n\t<div id=\"col-1746610477\" class=\"col medium-6 small-12 large-6\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_1459220602\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"704\" height=\"527\" src=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/3.png\" class=\"attachment-large size-large\" alt=\"montaje de pcb llave en mano\" srcset=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/3.png 704w, https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/3-300x225.png 300w\" sizes=\"(max-width: 704px) 100vw, 704px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_1459220602 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"0\">El material de la placa de circuito impreso, junto con el papel kraft y la placa superior, se env\u00eda a la prensa en caliente a trav\u00e9s de la secci\u00f3n de alimentaci\u00f3n seg\u00fan la configuraci\u00f3n del programa y, tras el prensado en fr\u00edo, se traslada a la secci\u00f3n de desmontaje a trav\u00e9s de la secci\u00f3n de descarga. La placa de acero y los productos semiacabados se desmontan autom\u00e1ticamente.<\/div>\n<div>5. Prensa en caliente<\/div>\n<div class=\"row\"  id=\"row-531438031\">\n\n\t<div id=\"col-1059447670\" class=\"col medium-6 small-12 large-6\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_1957385123\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"806\" height=\"598\" src=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/4.png\" class=\"attachment-large size-large\" alt=\"Placa de circuito impreso\" srcset=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/4.png 806w, https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/4-300x223.png 300w, https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/4-768x570.png 768w\" sizes=\"(max-width: 806px) 100vw, 806px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_1957385123 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n<\/div>\n<div class=\"okr-block-clipboard\" data-okr=\"%7B%22okrDelta%22%3A%5B%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20Hot%20press%20uses%20the%20healing%20energy%20of%20circulating%20Hot%20kerosene%20and%20the%20pressure%20provided%20by%20the%20piston%20of%20the%20hydraulic%20cylinder%20to%20heat%20and%20pressure%20in%20the%20vacuum%20environment.%20The%20combined%20plates%20make%20the%20PP%20in%20the%20combination%20transform%20from%20b-stage%20(semi-cured%20state)%20to%20C-stage%20(cured%20state)%20and%20then%20closely%20combine%20the%20plates%20of%20each%20inner%20plate.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%226%22%2C%22ol-id%22%3A%22nwuSxW8X%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Cold%20press%20%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20cured%20multilayer%20PCB%20is%20cooled%20by%20circulating%20cooling%20water%20and%20pressurized%20to%20prevent%20deformation%20of%20the%20multilayer%20plate%20for%20subsequent%20processing.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%227%22%2C%22ol-id%22%3A%22nwuSxW8X%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Automatic%20break%20down%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20semi-finished%20and%20pressed%20steel%20plate%20is%20decomposed%20by%20an%20automatic%20load%20shifting%20device.%20%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%228%22%2C%22ol-id%22%3A%22nwuSxW8X%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Manual%20break%20down%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Use%20a%20box%20cutter%20to%20decompose%20the%20semi-finished%20products%20of%20the%20Full%20sheet%20into%20working%20panels%20required%20by%20the%20following%20process.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%229%22%2C%22ol-id%22%3A%22nwuSxW8X%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22X-Ray%20Target%20drillingX-ray%20was%20used%20to%20find%20the%20inner%20positioning%20holes%20and%20milling%20holes%20to%20facilitate%20the%20positioning%20and%20processing%20of%20the%20subsequent%20process.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%2210%22%2C%22ol-id%22%3A%22nwuSxW8X%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22%C2%A0NC%20Router%20(Contour%20routing)Remove%20the%20glue%20from%20the%20edge%20of%20the%20PCB%20with%20a%20milling%20cutter.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%2211%22%2C%22ol-id%22%3A%22nwuSxW8X%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Automatic%20edge%20bevelingTrim%20the%20edges%20with%20props.%22%7D%7D%5D%7D%5D%2C%22businessKey%22%3A%22lark-doc%22%7D\"><span style=\"font-size: 14.4px;\">La prensa en caliente utiliza la energ\u00eda curativa del queroseno caliente que circula y la presi\u00f3n ejercida por el pist\u00f3n del cilindro hidr\u00e1ulico para aplicar calor y presi\u00f3n en un entorno al vac\u00edo. Las placas combinadas hacen que el PP pase de la fase B (estado semicurado) a la fase C (estado curado) y, a continuaci\u00f3n, unen estrechamente las placas de cada capa interior.<\/span><\/div>\n<div>6. Prensado en fr\u00edo<\/div>\n<div data-zone-id=\"0\" data-line-index=\"2\">\n<div>La placa de circuito impreso multicapa curada se enfr\u00eda mediante la circulaci\u00f3n de agua de refrigeraci\u00f3n y se presuriza para evitar la deformaci\u00f3n de la placa multicapa de cara a su posterior procesamiento.<\/div>\n<\/div>\n<div>7. Desglose autom\u00e1tico<\/div>\n<div data-zone-id=\"0\" data-line-index=\"4\">\n<div>La chapa de acero semiacabada y prensada se separa mediante un dispositivo autom\u00e1tico de desplazamiento de carga.<\/div>\n<\/div>\n<div>8. Desglose manual<\/div>\n<div data-zone-id=\"0\" data-line-index=\"6\">\n<div>Utiliza un c\u00fater para cortar los productos semiacabados de la l\u00e1mina completa en paneles de trabajo seg\u00fan las necesidades del proceso posterior.<\/div>\n<\/div>\n<div>9. Perforaci\u00f3n de objetivos para rayos X: se utilizaron rayos X para localizar los orificios de posicionamiento internos y los orificios de fresado, con el fin de facilitar el posicionamiento y el procesamiento en la fase posterior.<\/div>\n<div>10. Fresadora NC (fresado de contorno): Retira el pegamento del borde de la placa de circuito impreso con una fresa.<\/div>\n<div>11. Biselado autom\u00e1tico de bordes: Recorta los bordes con soportes.<\/div>\n<h2 class=\"okr-block-clipboard\" data-okr=\"%7B%22okrDelta%22%3A%5B%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20Methods%20of%20PCB%20Lamination%20Presses%22%2C%22bold%22%3Atrue%2C%22textcolor%22%3A%22rgba(36%2C91%2C219%2C1)%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%221.%20The%20tank%20pressure%20type%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20structure%20of%20the%20machine%20pressing%20machine%20for%20sealing%20module%2C%20outside%20storage%20pressure%2C%20the%20bag%20inside%20the%20vacuum%20hot%20press%20molding%2C%20each%20layer%20on%20the%20heat%20and%20pressure%2C%20pressure%20from%20all%20sides%20heating%20of%20the%20inert%20gas.%20%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Advantages%3A%22%2C%22bold%22%3Atrue%7D%7D%2C%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22%20due%20to%20the%20pressure%20and%20heat%20from%20all%20directions%2C%20thickness%20uniformity%20is%20good%2C%20suitable%20for%20Multilayer%20PCB.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Disadvantages%22%2C%22bold%22%3Atrue%7D%7D%2C%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22%3A%20equipment%20complex%2C%20high%20cost%2C%20yield%20less%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%222.%20The%20hydraulic%20press%20type%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20structure%20of%20the%20hydraulic%20pressing%20machine%20has%20vacuum%20type%20and%20atmospheric%20pressure%20type%2C%20the%20plate%20between%20the%20opening%20of%20each%20layer%20is%20sandwiched%20between%20the%20upper%20and%20lower%20hot%20plates%2C%20pressure%20from%20the%20upper%20and%20lower%20pressure%2C%20heat%20from%20the%20upper%20and%20lower%20hot%20plate%20heating%20to%20the%20plate.%20%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Advantages%3A%22%2C%22bold%22%3Atrue%7D%7D%2C%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22%20simple%20equipment%2C%20low%20cost%2C%20large%20output%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Disadvantages%3A%22%2C%22bold%22%3Atrue%7D%7D%2C%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22%20a%20large%20amount%20of%20glue%20flow%2C%20poor%20uniformity%20of%20PCB%20thickness%22%7D%7D%5D%7D%5D%2C%22businessKey%22%3A%22lark-doc%22%7D\">Los m\u00e9todos de las prensas de laminaci\u00f3n de placas de circuito impreso<\/h2>\n<h3 data-zone-id=\"0\" data-line-index=\"2\">1. El tipo de presi\u00f3n del dep\u00f3sito<\/h3>\n<div data-zone-id=\"0\" data-line-index=\"3\">La estructura de las prensas de laminaci\u00f3n de placas de circuito impreso (PCB) para el sellado del m\u00f3dulo consiste en una presi\u00f3n de almacenamiento exterior y un moldeado por prensado en caliente al vac\u00edo en el interior de la bolsa; cada capa se somete a calor y presi\u00f3n, y la presi\u00f3n se aplica desde todos los lados mediante el calentamiento con gas inerte.<\/div>\n<h4 data-zone-id=\"0\" data-line-index=\"4\">Ventajas:<\/h4>\n<div data-zone-id=\"0\" data-line-index=\"4\">Gracias a la presi\u00f3n y al calor que se aplican desde todas las direcciones, la uniformidad del espesor es buena, lo que lo hace adecuado para placas de circuito impreso multicapa.<\/div>\n<h4 data-zone-id=\"0\" data-line-index=\"5\">Desventajas:<\/h4>\n<p data-zone-id=\"0\" data-line-index=\"5\">Equipos complejos, alto coste, menor rendimiento<\/p>\n<h3 data-zone-id=\"0\" data-line-index=\"7\">2. El tipo de prensa hidr\u00e1ulica<\/h3>\n<p data-zone-id=\"0\" data-line-index=\"8\">La estructura de las prensas hidr\u00e1ulicas de laminaci\u00f3n de placas de circuito impreso (PCB) puede ser de vac\u00edo o de presi\u00f3n atmosf\u00e9rica; la placa, situada entre la abertura de cada capa, queda encajada entre las placas calefactoras superior e inferior, y recibe presi\u00f3n desde ambas, adem\u00e1s de calor procedente de las placas calefactoras superior e inferior.<\/p>\n<h4>Ventajas:<\/h4>\n<div data-zone-id=\"0\" data-line-index=\"9\">Equipo sencillo, bajo coste, gran rendimiento<\/div>\n<h4 data-zone-id=\"0\" data-line-index=\"10\">Desventajas:<\/h4>\n<div data-zone-id=\"0\" data-line-index=\"10\">Un flujo excesivo de pegamento y una uniformidad deficiente del grosor de la placa de circuito impreso<\/div>","protected":false},"excerpt":{"rendered":"<p>Muchos clientes debido a la falta de comprensi\u00f3n del proceso de prensado de laminaci\u00f3n de PCB, han sufrido un mont\u00f3n de p\u00e9rdidas: obtener el tablero de m\u00faltiples capas, pero encontr\u00f3 deformaci\u00f3n, estratificaci\u00f3n es evidente, e incluso la existencia de graves problemas de calidad, tales como el circuito abierto de la capa interna. La raz\u00f3n principal es que algunas f\u00e1bricas no...<\/p>","protected":false},"author":10,"featured_media":2966,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[16],"tags":[],"class_list":["post-2964","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>What is PCB Lamination Presses - Laminating Presses Manufacturer<\/title>\n<meta name=\"description\" content=\"PCB laminators are most commonly used to process printed circuit boards, copper clad boards and other materials for lamination.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/uetpcb.com\/es\/what-is-pcb-lamination-presses\/\" \/>\n<meta property=\"og:locale\" content=\"es_ES\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"What is PCB Lamination Presses - 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Laminating Presses Manufacturer\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/what-is-pcb-lamination-presses\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/what-is-pcb-lamination-presses\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/uetpcb.com\\\/wp-content\\\/uploads\\\/2021\\\/09\\\/2.png\",\"datePublished\":\"2021-09-08T05:49:46+00:00\",\"dateModified\":\"2022-05-09T06:17:30+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/#\\\/schema\\\/person\\\/18d09d6b81c74aa22a0ddb2bd628dd8e\"},\"description\":\"PCB laminators are most commonly used to process printed circuit boards, copper clad boards and other materials for lamination.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/what-is-pcb-lamination-presses\\\/#breadcrumb\"},\"inLanguage\":\"es\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/uetpcb.com\\\/what-is-pcb-lamination-presses\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"es\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/what-is-pcb-lamination-presses\\\/#primaryimage\",\"url\":\"https:\\\/\\\/uetpcb.com\\\/wp-content\\\/uploads\\\/2021\\\/09\\\/2.png\",\"contentUrl\":\"https:\\\/\\\/uetpcb.com\\\/wp-content\\\/uploads\\\/2021\\\/09\\\/2.png\",\"width\":501,\"height\":586,\"caption\":\"Printed circuit board machine\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/what-is-pcb-lamination-presses\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/uetpcb.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"News\",\"item\":\"https:\\\/\\\/uetpcb.com\\\/category\\\/news\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"What is PCB Lamination Presses\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/#website\",\"url\":\"https:\\\/\\\/uetpcb.com\\\/\",\"name\":\"UETPCB\",\"description\":\"\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/uetpcb.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"es\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/#\\\/schema\\\/person\\\/18d09d6b81c74aa22a0ddb2bd628dd8e\",\"name\":\"zhaowenli\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"es\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g\",\"caption\":\"zhaowenli\"},\"sameAs\":[\"https:\\\/\\\/x.com\\\/hx_admin\"]}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"\u00bfQu\u00e9 son las prensas de laminaci\u00f3n de PCB? - Fabricante de prensas de laminaci\u00f3n","description":"Las laminadoras de PCB se utilizan principalmente para procesar placas de circuito impreso, placas revestidas de cobre y otros materiales destinados a la laminaci\u00f3n.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/uetpcb.com\/es\/what-is-pcb-lamination-presses\/","og_locale":"es_ES","og_type":"article","og_title":"What is PCB Lamination Presses - Laminating Presses Manufacturer","og_description":"PCB laminators are most commonly used to process printed circuit boards, copper clad boards and other materials for lamination.","og_url":"https:\/\/uetpcb.com\/es\/what-is-pcb-lamination-presses\/","og_site_name":"UETPCB","article_published_time":"2021-09-08T05:49:46+00:00","article_modified_time":"2022-05-09T06:17:30+00:00","og_image":[{"width":501,"height":586,"url":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/2.png","type":"image\/png"}],"author":"zhaowenli","twitter_card":"summary_large_image","twitter_creator":"@hx_admin","twitter_misc":{"Escrito por":"zhaowenli","Tiempo de lectura":"4 minutos"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/#article","isPartOf":{"@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/"},"author":{"name":"zhaowenli","@id":"https:\/\/uetpcb.com\/#\/schema\/person\/18d09d6b81c74aa22a0ddb2bd628dd8e"},"headline":"What is PCB Lamination Presses","datePublished":"2021-09-08T05:49:46+00:00","dateModified":"2022-05-09T06:17:30+00:00","mainEntityOfPage":{"@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/"},"wordCount":813,"image":{"@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/#primaryimage"},"thumbnailUrl":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/2.png","articleSection":["News"],"inLanguage":"es"},{"@type":"WebPage","@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/","url":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/","name":"\u00bfQu\u00e9 son las prensas de laminaci\u00f3n de PCB? - Fabricante de prensas de laminaci\u00f3n","isPartOf":{"@id":"https:\/\/uetpcb.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/#primaryimage"},"image":{"@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/#primaryimage"},"thumbnailUrl":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/2.png","datePublished":"2021-09-08T05:49:46+00:00","dateModified":"2022-05-09T06:17:30+00:00","author":{"@id":"https:\/\/uetpcb.com\/#\/schema\/person\/18d09d6b81c74aa22a0ddb2bd628dd8e"},"description":"Las laminadoras de PCB se utilizan principalmente para procesar placas de circuito impreso, placas revestidas de cobre y otros materiales destinados a la laminaci\u00f3n.","breadcrumb":{"@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/#breadcrumb"},"inLanguage":"es","potentialAction":[{"@type":"ReadAction","target":["https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/"]}]},{"@type":"ImageObject","inLanguage":"es","@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/#primaryimage","url":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/2.png","contentUrl":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/09\/2.png","width":501,"height":586,"caption":"Printed circuit board machine"},{"@type":"BreadcrumbList","@id":"https:\/\/uetpcb.com\/what-is-pcb-lamination-presses\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/uetpcb.com\/"},{"@type":"ListItem","position":2,"name":"News","item":"https:\/\/uetpcb.com\/category\/news\/"},{"@type":"ListItem","position":3,"name":"What is PCB Lamination Presses"}]},{"@type":"WebSite","@id":"https:\/\/uetpcb.com\/#website","url":"https:\/\/uetpcb.com\/","name":"UETPCB","description":"","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/uetpcb.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"es"},{"@type":"Person","@id":"https:\/\/uetpcb.com\/#\/schema\/person\/18d09d6b81c74aa22a0ddb2bd628dd8e","name":"zhaowenli","image":{"@type":"ImageObject","inLanguage":"es","@id":"https:\/\/secure.gravatar.com\/avatar\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g","caption":"zhaowenli"},"sameAs":["https:\/\/x.com\/hx_admin"]}]}},"_links":{"self":[{"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/posts\/2964","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/users\/10"}],"replies":[{"embeddable":true,"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/comments?post=2964"}],"version-history":[{"count":6,"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/posts\/2964\/revisions"}],"predecessor-version":[{"id":2975,"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/posts\/2964\/revisions\/2975"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/media\/2966"}],"wp:attachment":[{"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/media?parent=2964"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/categories?post=2964"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/uetpcb.com\/es\/wp-json\/wp\/v2\/tags?post=2964"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}