{"id":2911,"date":"2021-12-07T13:00:51","date_gmt":"2021-12-07T05:00:51","guid":{"rendered":"https:\/\/uetpcb.com\/?p=2911"},"modified":"2021-12-20T16:42:31","modified_gmt":"2021-12-20T08:42:31","slug":"the-advantages-of-smt-manufacturing","status":"publish","type":"post","link":"https:\/\/uetpcb.com\/fr\/the-advantages-of-smt-manufacturing\/","title":{"rendered":"Les avantages de la fabrication SMT"},"content":{"rendered":"<div data-zone-id=\"0\" data-line-index=\"0\">123En 1960, la technologie du montage en surface a commenc\u00e9 \u00e0 se d\u00e9velopper. La technologie du montage en surface a \u00e9t\u00e9 largement utilis\u00e9e dans les ann\u00e9es 1980. En 1990, elle \u00e9tait utilis\u00e9e dans de nombreux assemblages de circuits imprim\u00e9s haut de gamme. Les composants \u00e9lectroniques traditionnels ont \u00e9t\u00e9 redessin\u00e9s pour \u00eatre fix\u00e9s directement \u00e0 une feuille de m\u00e9tal ou \u00e0 un capuchon d'extr\u00e9mit\u00e9 sur la surface de la carte. En d'autres termes, la technologie de montage en surface fait partie de l'assemblage \u00e9lectronique. La fabrication SMT est responsable du montage des composants \u00e9lectroniques sur la surface du circuit imprim\u00e9. Les composants \u00e9lectroniques mont\u00e9s de cette mani\u00e8re sont appel\u00e9s dispositifs de montage en surface (SMD). Ils remplacent les fils typiques qui doivent passer par des trous perc\u00e9s.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"1\">Par rapport au montage \u00e0 travers le trou, le SMT a des composants \u00e9lectroniques plus petits. Cela signifie \u00e9galement qu'elle permet de placer plus fr\u00e9quemment des composants des deux c\u00f4t\u00e9s de la carte. Aujourd'hui, presque tous les appareils fabriqu\u00e9s dans le commerce utilisent la technologie de montage en surface en raison des nombreux avantages qu'elle offre dans le processus de fabrication des circuits imprim\u00e9s. En raison des nombreux avantages qu'elle offre dans le processus de fabrication des circuits imprim\u00e9s, la technologie de montage en surface permet de minimiser les co\u00fbts de fabrication tout en utilisant efficacement l'espace disponible sur les circuits imprim\u00e9s. Dans cet article, nous examinerons les diff\u00e9rents avantages de la technologie de montage en surface.<\/div>\n<div class=\"row\"  id=\"row-349904019\">\n\n\t<div id=\"col-568259889\" class=\"col medium-6 small-12 large-6\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_853160781\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"615\" height=\"384\" src=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/07\/\u56fe\u72471.png\" class=\"attachment-large size-large\" alt=\"PCB en aluminium\" srcset=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/07\/\u56fe\u72471.png 615w, https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/07\/\u56fe\u72471-300x187.png 300w\" sizes=\"(max-width: 615px) 100vw, 615px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_853160781 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n\n\t<div id=\"col-1958711236\" class=\"col medium-6 small-12 large-6\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_1055656847\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img decoding=\"async\" width=\"640\" height=\"390\" src=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/08\/pcb.png\" class=\"attachment-large size-large\" alt=\"Circuit imprim\u00e9\" srcset=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/08\/pcb.png 640w, https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/08\/pcb-300x183.png 300w\" sizes=\"(max-width: 640px) 100vw, 640px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_1055656847 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n<\/div>\n<h3 class=\"okr-block-clipboard\" data-okr=\"%7B%22okrDelta%22%3A%5B%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Small%20size%20and%20low%20weight%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Surface%20mount%20technology%20(SMT)%20allows%20components%20to%20place%20closer%20to%20the%20board.%20This%20allows%20for%20the%20creation%20of%20smaller%20PCB%20designs.%20This%20means%20that%20assembled%20devices%20can%20design%20to%20be%20lighter%20and%20more%20compact.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Under%20normal%20circumstances%2C%20SMD%20components%20are%2060-80%25%20smaller%20than%20their%20through-hole%20counterparts.%20And%20can%20even%20reduce%20some%20components%20in%20size%20and%20volume%20by%20up%20to%2090%25.%20Therefore%2C%20the%20size%20and%20volume%20of%20SMT%20electronic%20components%20are%20much%20smaller%20than%20those%20of%20through-hole%20interpolation%20components.%20The%20small%20size%20of%20SMD%20components%20is%20well%20known%2C%20so%20it%20is%20also%20much%20lighter.%20As%20a%20result%2C%20they%20take%20up%20less%20space%20on%20the%20SMT%20PCB%2C%20which%20makes%20them%20smaller%20and%20thinner.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22SMT%20manufactured%20parts%20usually%20do%20not%20require%20insertion%20and%20soldering%2C%20so%20it%20is%20usually%20smaller%20than%20PTH%20parts.%20SMT%20components%20do%20not%20require%20long%20leads%2C%20so%20this%20means%20that%20designers%20can%20fit%20more%20components%20into%20a%20smaller%20space.%20This%20can%20then%20be%20done%20on%20the%20board%20using%20PTH%20parts.%20And%20because%20of%20the%20size%20and%20volume%2C%20SMT%20parts%20are%20usually%20cheaper%20than%20PTH%20parts.%20SMT%20parts%20are%20also%20more%20readily%20available%20than%20PTH%20parts.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Low%20cost%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22SMT%20manufacturing%20allows%20for%20faster%20volume%20production%20than%20its%20through-hole%20counterpart%20because%20it%20does%20not%20require%20drilling%20the%20circuit%20board%20for%20assembly.%20This%20also%20means%20that%20the%20initial%20cost%20of%20SMT%20manufacturing%20is%20lower.%20SMT%20PCBs%20are%20smaller%20in%20size%20and%20do%20not%20require%20any%20plated%20through-hole.%20Many%20SMD%20components%20also%20cost%20less%20than%20through-hole%20electronic%20components.%20This%20helps%20reduce%20the%20cost%20of%20manufacturing%20SMT%20circuit%20boards.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Because%20surface%20mount%20assemblies%20are%20smaller%20and%20thinner%2C%20the%20cost%20of%20packaging%20and%20shipping%20aspects%20of%20the%20SMT%20manufacturing%20process%20are%20reduced.%20Previous%20circuit%20board%20assembly%20required%20the%20leads%20of%20through-hole%20electronic%20components%20to%20be%20manually%20inserted%20into%20plated%20through-holes.%20This%20is%20not%20the%20case%20with%20SMT%20manufacturing.%20With%20the%20use%20of%20automated%20SMT%20placement%20machines%20in%20SMT%20manufacturing%2C%20they%20can%20be%20placed%20on%20the%20board%20automatically.%20This%20reduces%20the%20processing%20and%20production%20costs%20of%20SMT%20manufacturing.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22SMT%20manufacturing%20has%20a%20smaller%20radiation%20loop%20area%20due%20to%20its%20compact%20package%20and%20lower%20lead%20inductance.%20Therefore%20it%20has%20better%20EMC%20compatibility%20(lower%20radiated%20emissions).%20Component%20leads%20do%20not%20need%20to%20be%20bent%2C%20formed%2C%20or%20cut%20short%20for%20SMT%20manufacturing.%20This%20shortens%20the%20entire%20process%20of%20SMT%20manufacturing%20and%20increases%20productivity.%20Experience%20shows%20that%20the%20processing%20cost%20of%20the%20same%20functional%20circuit%20is%20lower%20than%20through-hole%20interpolation%2C%20which%20generally%20reduces%20the%20total%20production%20cost%20by%2030%25%20to%2050%25.%22%7D%7D%5D%7D%5D%2C%22businessKey%22%3A%22lark-doc%22%7D\"><span style=\"font-size: 20.16px;\">Petite taille et faible poids<\/span><\/h3>\n<div data-zone-id=\"0\" data-line-index=\"1\">La technologie de montage en surface (SMT) permet de placer les composants plus pr\u00e8s de la carte. Cela permet de cr\u00e9er des circuits imprim\u00e9s plus petits. Cela signifie que les appareils assembl\u00e9s peuvent \u00eatre con\u00e7us pour \u00eatre plus l\u00e9gers et plus compacts.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"2\">Dans des circonstances normales, les composants CMS sont 60-80% plus petits que leurs homologues \u00e0 trous traversants. Ils peuvent m\u00eame r\u00e9duire la taille et le volume de certains composants jusqu'\u00e0 90%. Par cons\u00e9quent, la taille et le volume des composants \u00e9lectroniques CMS sont beaucoup plus petits que ceux des composants d'interpolation \u00e0 trous traversants. La petite taille des composants CMS est bien connue, ils sont donc \u00e9galement beaucoup plus l\u00e9gers. Par cons\u00e9quent, ils occupent moins d'espace sur le circuit imprim\u00e9 SMT, ce qui les rend plus petits et plus minces.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"3\">Les pi\u00e8ces fabriqu\u00e9es par SMT ne n\u00e9cessitent g\u00e9n\u00e9ralement pas d'insertion ni de soudure, et sont donc g\u00e9n\u00e9ralement plus petites que les pi\u00e8ces fabriqu\u00e9es par PTH. Les composants SMT ne n\u00e9cessitent pas de longs fils, ce qui signifie que les concepteurs peuvent ins\u00e9rer plus de composants dans un espace plus r\u00e9duit. Cela peut ensuite \u00eatre fait sur la carte \u00e0 l'aide de pi\u00e8ces PTH. En raison de leur taille et de leur volume, les composants SMT sont g\u00e9n\u00e9ralement moins chers que les composants PTH. Les pi\u00e8ces SMT sont \u00e9galement plus facilement disponibles que les pi\u00e8ces PTH.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"4\">\n<h3 class=\"heading-h3\">Faible co\u00fbt<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"5\">La fabrication SMT permet une production en volume plus rapide que son homologue \u00e0 trous traversants, car il n'est pas n\u00e9cessaire de percer la carte de circuit imprim\u00e9 pour l'assembler. Cela signifie \u00e9galement que le co\u00fbt initial de la fabrication SMT est moins \u00e9lev\u00e9. Les circuits imprim\u00e9s CMS sont plus petits et ne n\u00e9cessitent pas de trous traversants plaqu\u00e9s. De nombreux composants CMS co\u00fbtent \u00e9galement moins cher que les composants \u00e9lectroniques \u00e0 trous traversants. Cela contribue \u00e0 r\u00e9duire le co\u00fbt de fabrication des circuits imprim\u00e9s SMT.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"6\">Les assemblages par montage en surface \u00e9tant plus petits et plus minces, les co\u00fbts d'emballage et d'exp\u00e9dition du processus de fabrication SMT sont r\u00e9duits. L'assemblage de cartes de circuits imprim\u00e9s exigeait auparavant que les fils des composants \u00e9lectroniques traversants soient ins\u00e9r\u00e9s manuellement dans les trous traversants plaqu\u00e9s. Ce n'est pas le cas avec la fabrication SMT. Gr\u00e2ce \u00e0 l'utilisation de machines automatis\u00e9es de placement SMT dans la fabrication SMT, ils peuvent \u00eatre plac\u00e9s automatiquement sur la carte. Cela permet de r\u00e9duire les co\u00fbts de traitement et de production de la fabrication CMS.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"7\">La fabrication SMT pr\u00e9sente une zone de boucle de rayonnement plus petite en raison de son bo\u00eetier compact et d'une inductance de fil plus faible. Elle pr\u00e9sente donc une meilleure compatibilit\u00e9 CEM (\u00e9missions rayonn\u00e9es plus faibles). Les fils des composants n'ont pas besoin d'\u00eatre pli\u00e9s, form\u00e9s ou raccourcis pour la fabrication SMT. Cela permet de raccourcir l'ensemble du processus de fabrication SMT et d'augmenter la productivit\u00e9. L'exp\u00e9rience montre que le co\u00fbt de traitement du m\u00eame circuit fonctionnel est inf\u00e9rieur \u00e0 celui de l'interpolation \u00e0 travers le trou, ce qui r\u00e9duit g\u00e9n\u00e9ralement le co\u00fbt total de production de 30% \u00e0 50%.<\/div>\n<h3 class=\"okr-block-clipboard\" data-okr=\"%7B%22okrDelta%22%3A%5B%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Surface%20Mount%20Technology%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Printed%20circuit%20boards%20made%20using%20the%20SMT%20process%20are%20more%20compact%2C%20and%20the%20circuits%20are%20faster.%20With%20electronic%20devices%20now%20demanding%20speed%2C%20the%20SMT%20manufacturing%20process%20is%20becoming%20increasingly%20popular%20with%20manufacturers.%20And%20its%20high-end%20components%20allow%20for%20multitasking.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Components%20can%20place%20on%20both%20sides%20of%20the%20board%20and%20can%20connect%20more%20components.%20The%20surface%20tension%20of%20the%20molten%20solder%20pulls%20the%20components%20into%20alignment%20with%20the%20pads%2C%20and%20it%20automatically%20corrects%20small%20errors%20in%20component%20placement.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22SMT%20manufacturing%20ensures%20low%20resistance%20and%20inductance%20at%20the%20connections.%20This%20reduces%20the%20harmful%20effects%20of%20RF%20signals%20and%20provides%20better%2C%20more%20predictable%20high%20frequency%20performance.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22High%20level%20of%20automation%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Most%20SMT%20parts%20can%20be%20easily%20mounted%20on%20the%20board%20using%20automatic%20pick-and-place%20equipment.%20Large%20quantities%20of%20parts%2C%20such%20as%20passive%20components%2C%20are%20loaded%20into%20the%20mounter%20from%20a%20spool%2C%20while%20other%20parts%20load%20from%20a%20tube%20feeder%20or%20tray.%20This%20is%20a%20very%20important%20difference%20from%20PTH%20parts%2C%20which%20typically%20must%20be%20assembly%20manually.%20SMT%20parts%20are%20typically%20cheaper%20than%20PTH%20parts%20due%20to%20their%20size%20and%20volume.%20SMT%20parts%20are%20also%20more%20readily%20available%20than%20PTH%20parts%20because%20they%20are%20in%20high%20demand.%20The%20standardization%2C%20serialization%2C%20and%20consistency%20of%20soldering%20conditions%20for%20SMD%20components%20make%20SMT%20highly%20automated.%20Component%20failures%20caused%20by%20the%20soldering%20process%20will%20be%20greatly%20reduced%20and%20will%20improve%20reliability.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Low%20noise%20level%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22SMT%20PCB%20Assembly%20can%20support%20high%20density%2C%20mainly%20double-sided%20PCBs%20and%20Multiplayer%20PCBs.%20Due%20to%20the%20short%20delay%20time%2C%20these%20boards%20are%20capable%20of%20high%20speed%20signal%20transmission.%20Also%2C%20because%20SMD%20components%20have%20no%20leads%20or%20short%20leads%2C%20RF%20interference%20is%20reduced.%20In%20addition%2C%20SMT%20PCB%20assemblies%20provide%20greater%20vibration%20immunity%20and%20are%20less%20noisy.%20Since%20the%20components%20have%20no%20leads%20or%20short%20leads%2C%20the%20distribution%20parameters%20of%20the%20circuit%20are%20naturally%20lower%2C%20and%20RF%20interference%20is%20reduced.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Practical%20and%20Cost-Effective%22%2C%22bold%22%3Atrue%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Today%2C%20almost%20all%20commercially%20manufactured%20devices%20use%20surface%20mount%20technology%20because%20it%20offers%20many%20advantages%20in%20the%20PCB%20manufacturing%20process.%20Increasingly%2C%20PCB%20devices%20are%20being%20offered%20in%20SMD%20or%20package%20form.%20This%20makes%20manufacturing%20with%20SMT%20very%20practical%20and%20cost%20effective.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22SMT%20assembled%20components%20are%20not%20only%20compact%20but%20also%20have%20a%20high%20security%20density.%20When%20PCBs%20are%20pasted%20on%20both%20sides%2C%20the%20assembly%20density%20can%20reach%205.5%20to%2020%20solder%20joints%20per%20sq.%20cm.%20SMT%20assembled%20PCBs%20can%20achieve%20high%20speed%20signal%20transmission%20due%20to%20short%20circuits%20and%20small%20delays.%20At%20the%20same%20time%2C%20SMT%20assembled%20PCBs%20are%20more%20resistant%20to%20vibration%20and%20shock.%20This%20is%20important%20for%20achieving%20ultra-high-speed%20operation%20of%20electronic%20devices.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%5D%7D%5D%2C%22businessKey%22%3A%22lark-doc%22%7D\"><span style=\"font-size: 20.16px;\">Technologie de montage en surface<\/span><\/h3>\n<div data-zone-id=\"0\" data-line-index=\"1\">Les circuits imprim\u00e9s fabriqu\u00e9s selon le proc\u00e9d\u00e9 SMT sont plus compacts et les circuits sont plus rapides. Les appareils \u00e9lectroniques exigeant d\u00e9sormais de la rapidit\u00e9, le processus de fabrication SMT est de plus en plus pris\u00e9 par les fabricants. De plus, ses composants haut de gamme permettent d'effectuer plusieurs t\u00e2ches \u00e0 la fois.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"2\">Les composants peuvent \u00eatre plac\u00e9s des deux c\u00f4t\u00e9s de la carte et peuvent \u00eatre connect\u00e9s \u00e0 d'autres composants. La tension superficielle de la soudure en fusion entra\u00eene les composants dans l'alignement des pastilles et corrige automatiquement les petites erreurs de placement des composants.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"3\">La fabrication SMT garantit une faible r\u00e9sistance et une faible inductance au niveau des connexions. Cela r\u00e9duit les effets nocifs des signaux RF et permet d'obtenir des performances \u00e0 haute fr\u00e9quence meilleures et plus pr\u00e9visibles.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"4\">\n<h3 class=\"heading-h3\">Haut niveau d'automatisation<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"5\">La plupart des pi\u00e8ces SMT peuvent \u00eatre facilement mont\u00e9es sur la carte \u00e0 l'aide d'un \u00e9quipement automatique de prise et de placement. De grandes quantit\u00e9s de pi\u00e8ces, telles que les composants passifs, sont charg\u00e9es dans l'appareil de montage \u00e0 partir d'une bobine, tandis que d'autres pi\u00e8ces sont charg\u00e9es \u00e0 partir d'un tube d'alimentation ou d'un plateau. Il s'agit d'une diff\u00e9rence tr\u00e8s importante par rapport aux pi\u00e8ces PTH, qui doivent g\u00e9n\u00e9ralement \u00eatre assembl\u00e9es manuellement. Les pi\u00e8ces CMS sont g\u00e9n\u00e9ralement moins ch\u00e8res que les pi\u00e8ces PTH en raison de leur taille et de leur volume. Les pi\u00e8ces CMS sont \u00e9galement plus facilement disponibles que les pi\u00e8ces PTH car elles sont tr\u00e8s demand\u00e9es. La normalisation, la s\u00e9rialisation et la coh\u00e9rence des conditions de brasage pour les composants SMD rendent le SMT hautement automatis\u00e9. Les d\u00e9faillances des composants caus\u00e9es par le processus de brasage seront consid\u00e9rablement r\u00e9duites et la fiabilit\u00e9 sera am\u00e9lior\u00e9e.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"6\">\n<h3 class=\"heading-h3\">Faible niveau sonore<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"7\">L'assemblage de circuits imprim\u00e9s SMT peut prendre en charge une densit\u00e9 \u00e9lev\u00e9e, principalement des circuits imprim\u00e9s double face et des circuits imprim\u00e9s multijoueurs. En raison du d\u00e9lai d'attente court, ces cartes sont capables de transmettre des signaux \u00e0 grande vitesse. En outre, comme les composants SMD n'ont pas de fils ou des fils courts, les interf\u00e9rences RF sont r\u00e9duites. En outre, les assemblages de circuits imprim\u00e9s SMT offrent une meilleure immunit\u00e9 aux vibrations et sont moins bruyants. Comme les composants n'ont pas de fils ou de fils courts, les param\u00e8tres de distribution du circuit sont naturellement plus faibles et les interf\u00e9rences RF sont r\u00e9duites.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"8\">\n<div><b>Pratique et rentable<\/b><\/div>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"9\">Aujourd'hui, presque tous les appareils fabriqu\u00e9s dans le commerce utilisent la technologie du montage en surface, car elle offre de nombreux avantages dans le processus de fabrication des circuits imprim\u00e9s. De plus en plus d'appareils pour circuits imprim\u00e9s sont propos\u00e9s sous forme de CMS ou de bo\u00eetiers. Cela rend la fabrication avec la technologie SMT tr\u00e8s pratique et rentable.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"10\">Les composants assembl\u00e9s par SMT sont non seulement compacts, mais ils pr\u00e9sentent \u00e9galement une densit\u00e9 de s\u00e9curit\u00e9 \u00e9lev\u00e9e. Lorsque les circuits imprim\u00e9s sont coll\u00e9s des deux c\u00f4t\u00e9s, la densit\u00e9 d'assemblage peut atteindre 5,5 \u00e0 20 joints de soudure par cm\u00b2. Les circuits imprim\u00e9s assembl\u00e9s par SMT peuvent transmettre des signaux \u00e0 grande vitesse gr\u00e2ce \u00e0 des circuits courts et \u00e0 de faibles retards. En m\u00eame temps, les circuits imprim\u00e9s assembl\u00e9s par SMT sont plus r\u00e9sistants aux vibrations et aux chocs. Ceci est important pour obtenir un fonctionnement \u00e0 ultra-haute vitesse des appareils \u00e9lectroniques.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"11\"><\/div>\n<h2 class=\"okr-block-clipboard\" data-okr=\"%7B%22okrDelta%22%3A%5B%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Processes%20involved%20in%20MT%20manufacturing%22%2C%22bold%22%3Atrue%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22SMT%20manufacturing%20typically%20consists%20of%20several%20highly%20automated%20SMT%20manufacturing%20processes%20that%20include%20the%20following%20basic%20steps.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%221%22%2C%22ol-id%22%3A%22LVf9DDdf%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Board%20material%3A%20The%20pads%20(without%20holes)%20and%20solder%20paste%20are%20applied%20by%20a%20process%20similar%20to%20screen%20printing.%20The%20placement%20of%20the%20PCB%20is%20controlled%20by%20precise%20stencils%20to%20ensure%20that%20material%20is%20applied%20only%20where%20it%20is%20needed.%20This%20minimizes%20costs.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%222%22%2C%22ol-id%22%3A%22LVf9DDdf%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Automatic%20component%20pick-up%20and%20placement%20machine.%20It%20positions%20the%20required%20SMD%20and%20other%20components%20precisely%20on%20the%20board.%20They%20are%20usually%20fed%20into%20the%20machine%20via%20reels%20or%20tapes.%20In%20SMT%20manufacturing%20for%20components%20such%20as%20integrated%20circuits%20are%20delivered%20in%20a%20static-free%20medium.%20The%20board%20then%20proceeds%20to%20the%20soldering%20operation.%20SMT%20manufacturing%20heats%20the%20pads%20to%20the%20point%20where%20the%20applied%20solder%20paste%20melts%20and%20bonds%20the%20components%20to%20the%20board.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%223%22%2C%22ol-id%22%3A%22LVf9DDdf%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Repeat%20the%20placement%2Fsoldering%20process%20for%20the%20reverse%20side%20when%20both%20sides%20of%20the%20printed%20circuit%20board%20are%20used%20for%20components.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%224%22%2C%22ol-id%22%3A%22LVf9DDdf%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22Any%20thermal%20component%20contained%20on%20the%20PCB%20can%20mount%20after%20automatic%20soldering.%20Either%20manually%20or%20through%20a%20process%20that%20does%20not%20damage%20the%20components.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%225%22%2C%22ol-id%22%3A%22LVf9DDdf%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20board%20is%20then%20%5C%22cleaned%5C%22%20to%20remove%20excess%20flux%20or%20solder%20residue.%20These%20residues%20can%20cause%20component%20shorts%20due%20to%20the%20close%20placement%20tolerances%20in%20SMT%20manufacturing.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22text%22%2C%22lineOptions%22%3A%7B%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22%20Once%20the%20product%20can%20finish%2C%20cleaned%2C%20and%20dried%2C%20it%20is%20ready%20for%20final%20quality%20inspection.%20The%20inspection%20looks%20for%20missing%20components%2C%20alignment%20issues%2C%20or%20soldering%20problems%20that%20could%20create%20potential%20problems.%20There%20is%20equipment%20available%20to%20automate%20these%20checks.%22%7D%7D%5D%7D%2C%7B%22lineType%22%3A%22order%22%2C%22lineOptions%22%3A%7B%22level%22%3A1%2C%22start%22%3A%226%22%2C%22ol-id%22%3A%22LVf9DDdf%22%7D%2C%22lineContent%22%3A%5B%7B%22opType%22%3A%22text%22%2C%22options%22%3A%7B%22text%22%3A%22The%20inspected%20board%20is%20then%20subjected%20to%20any%20required%20circuit%20and%20functional%20tests.%22%7D%7D%5D%7D%5D%2C%22businessKey%22%3A%22lark-doc%22%7D\">Proc\u00e9d\u00e9s de fabrication des MT<\/h2>\n<div data-zone-id=\"0\" data-line-index=\"1\">La fabrication de CMS consiste g\u00e9n\u00e9ralement en plusieurs processus de fabrication de CMS hautement automatis\u00e9s qui comprennent les \u00e9tapes de base suivantes.<\/div>\n<h3>Mat\u00e9riau du panneau :<\/h3>\n<p>Les pastilles (sans trous) et la p\u00e2te \u00e0 braser sont appliqu\u00e9es par un proc\u00e9d\u00e9 similaire \u00e0 la s\u00e9rigraphie. L'emplacement du circuit imprim\u00e9 est contr\u00f4l\u00e9 par des pochoirs pr\u00e9cis qui garantissent que le mat\u00e9riau n'est appliqu\u00e9 que l\u00e0 o\u00f9 il est n\u00e9cessaire. Cela permet de minimiser les co\u00fbts.<\/p>\n<ol start=\"1\">\n<li class=\"\" data-list=\"number1\" data-ol-id=\"LVf9DDdf\" data-start=\"2\">Machine automatique de prise et de placement de composants. Elle positionne avec pr\u00e9cision les composants SMD et autres sur la carte. Ils sont g\u00e9n\u00e9ralement introduits dans la machine par des bobines ou des bandes. Dans la fabrication SMT, les composants tels que les circuits int\u00e9gr\u00e9s sont livr\u00e9s dans un milieu exempt d'\u00e9lectricit\u00e9 statique. La carte passe ensuite \u00e0 l'op\u00e9ration de soudage. La fabrication SMT chauffe les pads jusqu'\u00e0 ce que la p\u00e2te \u00e0 braser appliqu\u00e9e fonde et lie les composants \u00e0 la carte.<\/li>\n<li class=\"\" data-list=\"number1\" data-ol-id=\"LVf9DDdf\" data-start=\"3\">\n<div>R\u00e9p\u00e9tez le processus de placement\/soudure pour le verso lorsque les deux faces du circuit imprim\u00e9 sont utilis\u00e9es pour les composants.<\/div>\n<\/li>\n<li class=\"\" data-list=\"number1\" data-ol-id=\"LVf9DDdf\" data-start=\"4\">Tout composant thermique contenu sur le circuit imprim\u00e9 peut \u00eatre mont\u00e9 apr\u00e8s le brasage automatique. Soit manuellement, soit par un proc\u00e9d\u00e9 qui n'endommage pas les composants.<\/li>\n<li class=\"\" data-list=\"number1\" data-ol-id=\"LVf9DDdf\" data-start=\"5\">La carte est ensuite \"nettoy\u00e9e\" pour \u00e9liminer l'exc\u00e8s de flux ou les r\u00e9sidus de soudure. Ces r\u00e9sidus peuvent provoquer des courts-circuits entre les composants en raison des tol\u00e9rances de placement \u00e9troites dans la fabrication SMT.<\/li>\n<li class=\"\" data-list=\"number1\" data-ol-id=\"LVf9DDdf\" data-start=\"5\">Une fois le produit fini, nettoy\u00e9 et s\u00e9ch\u00e9, il est pr\u00eat pour l'inspection finale de la qualit\u00e9. Ce contr\u00f4le vise \u00e0 d\u00e9tecter les composants manquants, les probl\u00e8mes d'alignement ou de soudure susceptibles de cr\u00e9er des probl\u00e8mes potentiels. Il existe des \u00e9quipements permettant d'automatiser ces contr\u00f4les.<\/li>\n<\/ol>\n<ol start=\"6\">\n<li class=\"\" data-list=\"number1\" data-ol-id=\"LVf9DDdf\" data-start=\"6\">La carte inspect\u00e9e est ensuite soumise \u00e0 tous les tests de circuit et de fonctionnement requis.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":"<p>123En 1960, la technologie du montage en surface a commenc\u00e9 \u00e0 se d\u00e9velopper. La technologie du montage en surface a \u00e9t\u00e9 largement utilis\u00e9e dans les ann\u00e9es 1980. En 1990, elle \u00e9tait utilis\u00e9e dans de nombreux assemblages de circuits imprim\u00e9s haut de gamme. Les composants \u00e9lectroniques traditionnels ont \u00e9t\u00e9 redessin\u00e9s pour se fixer directement sur une feuille de m\u00e9tal ou un capuchon d'extr\u00e9mit\u00e9 \u00e0 la surface de la carte. En d'autres termes, la technologie de montage en surface fait partie...<\/p>","protected":false},"author":10,"featured_media":2321,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[16],"tags":[],"class_list":["post-2911","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Advantages &amp; Disadvantages of SMT Manufacturing<\/title>\n<meta name=\"description\" content=\"Compared to its counterpart through-hole technology, the SMT manufacturing process offers a faster production setup.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/uetpcb.com\/fr\/les-avantages-de-la-fabrication-de-smt\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Advantages &amp; Disadvantages of SMT Manufacturing\" \/>\n<meta property=\"og:description\" content=\"Compared to its counterpart through-hole technology, the SMT manufacturing process offers a faster production setup.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/uetpcb.com\/fr\/les-avantages-de-la-fabrication-de-smt\/\" \/>\n<meta property=\"og:site_name\" content=\"UETPCB\" \/>\n<meta property=\"article:published_time\" content=\"2021-12-07T05:00:51+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2021-12-20T08:42:31+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/03\/PCB-2.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"897\" \/>\n\t<meta property=\"og:image:height\" content=\"596\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"zhaowenli\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@hx_admin\" \/>\n<meta name=\"twitter:label1\" content=\"\u00c9crit par\" \/>\n\t<meta name=\"twitter:data1\" content=\"zhaowenli\" \/>\n\t<meta name=\"twitter:label2\" content=\"Dur\u00e9e de lecture estim\u00e9e\" \/>\n\t<meta name=\"twitter:data2\" content=\"6 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/\"},\"author\":{\"name\":\"zhaowenli\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/#\\\/schema\\\/person\\\/18d09d6b81c74aa22a0ddb2bd628dd8e\"},\"headline\":\"The Advantages of SMT Manufacturing\",\"datePublished\":\"2021-12-07T05:00:51+00:00\",\"dateModified\":\"2021-12-20T08:42:31+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/\"},\"wordCount\":1291,\"image\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/uetpcb.com\\\/wp-content\\\/uploads\\\/2021\\\/03\\\/PCB-2.jpg\",\"articleSection\":[\"News\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/\",\"url\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/\",\"name\":\"Advantages & Disadvantages of SMT Manufacturing\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/uetpcb.com\\\/wp-content\\\/uploads\\\/2021\\\/03\\\/PCB-2.jpg\",\"datePublished\":\"2021-12-07T05:00:51+00:00\",\"dateModified\":\"2021-12-20T08:42:31+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/#\\\/schema\\\/person\\\/18d09d6b81c74aa22a0ddb2bd628dd8e\"},\"description\":\"Compared to its counterpart through-hole technology, the SMT manufacturing process offers a faster production setup.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/#primaryimage\",\"url\":\"https:\\\/\\\/uetpcb.com\\\/wp-content\\\/uploads\\\/2021\\\/03\\\/PCB-2.jpg\",\"contentUrl\":\"https:\\\/\\\/uetpcb.com\\\/wp-content\\\/uploads\\\/2021\\\/03\\\/PCB-2.jpg\",\"width\":897,\"height\":596,\"caption\":\"Printed circuit board\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/the-advantages-of-smt-manufacturing\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/uetpcb.com\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"News\",\"item\":\"https:\\\/\\\/uetpcb.com\\\/category\\\/news\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"The Advantages of SMT Manufacturing\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/#website\",\"url\":\"https:\\\/\\\/uetpcb.com\\\/\",\"name\":\"UETPCB\",\"description\":\"\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/uetpcb.com\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/uetpcb.com\\\/#\\\/schema\\\/person\\\/18d09d6b81c74aa22a0ddb2bd628dd8e\",\"name\":\"zhaowenli\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g\",\"caption\":\"zhaowenli\"},\"sameAs\":[\"https:\\\/\\\/x.com\\\/hx_admin\"]}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Avantages et inconv\u00e9nients de la fabrication SMT","description":"Par rapport \u00e0 la technologie du trou traversant, le processus de fabrication SMT permet une mise en place plus rapide de la production.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/uetpcb.com\/fr\/les-avantages-de-la-fabrication-de-smt\/","og_locale":"fr_FR","og_type":"article","og_title":"Advantages & Disadvantages of SMT Manufacturing","og_description":"Compared to its counterpart through-hole technology, the SMT manufacturing process offers a faster production setup.","og_url":"https:\/\/uetpcb.com\/fr\/les-avantages-de-la-fabrication-de-smt\/","og_site_name":"UETPCB","article_published_time":"2021-12-07T05:00:51+00:00","article_modified_time":"2021-12-20T08:42:31+00:00","og_image":[{"width":897,"height":596,"url":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/03\/PCB-2.jpg","type":"image\/jpeg"}],"author":"zhaowenli","twitter_card":"summary_large_image","twitter_creator":"@hx_admin","twitter_misc":{"\u00c9crit par":"zhaowenli","Dur\u00e9e de lecture estim\u00e9e":"6 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/#article","isPartOf":{"@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/"},"author":{"name":"zhaowenli","@id":"https:\/\/uetpcb.com\/#\/schema\/person\/18d09d6b81c74aa22a0ddb2bd628dd8e"},"headline":"The Advantages of SMT Manufacturing","datePublished":"2021-12-07T05:00:51+00:00","dateModified":"2021-12-20T08:42:31+00:00","mainEntityOfPage":{"@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/"},"wordCount":1291,"image":{"@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/#primaryimage"},"thumbnailUrl":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/03\/PCB-2.jpg","articleSection":["News"],"inLanguage":"fr-FR"},{"@type":"WebPage","@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/","url":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/","name":"Avantages et inconv\u00e9nients de la fabrication SMT","isPartOf":{"@id":"https:\/\/uetpcb.com\/#website"},"primaryImageOfPage":{"@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/#primaryimage"},"image":{"@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/#primaryimage"},"thumbnailUrl":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/03\/PCB-2.jpg","datePublished":"2021-12-07T05:00:51+00:00","dateModified":"2021-12-20T08:42:31+00:00","author":{"@id":"https:\/\/uetpcb.com\/#\/schema\/person\/18d09d6b81c74aa22a0ddb2bd628dd8e"},"description":"Par rapport \u00e0 la technologie du trou traversant, le processus de fabrication SMT permet une mise en place plus rapide de la production.","breadcrumb":{"@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/"]}]},{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/#primaryimage","url":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/03\/PCB-2.jpg","contentUrl":"https:\/\/uetpcb.com\/wp-content\/uploads\/2021\/03\/PCB-2.jpg","width":897,"height":596,"caption":"Printed circuit board"},{"@type":"BreadcrumbList","@id":"https:\/\/uetpcb.com\/the-advantages-of-smt-manufacturing\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/uetpcb.com\/"},{"@type":"ListItem","position":2,"name":"News","item":"https:\/\/uetpcb.com\/category\/news\/"},{"@type":"ListItem","position":3,"name":"The Advantages of SMT Manufacturing"}]},{"@type":"WebSite","@id":"https:\/\/uetpcb.com\/#website","url":"https:\/\/uetpcb.com\/","name":"UETPCB","description":"","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/uetpcb.com\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"fr-FR"},{"@type":"Person","@id":"https:\/\/uetpcb.com\/#\/schema\/person\/18d09d6b81c74aa22a0ddb2bd628dd8e","name":"zhaowenli","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/secure.gravatar.com\/avatar\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/e69a5ddb70a8355c4b2fa1642f615f9d93ab9eceda3c3be9801821ffd622c9c6?s=96&d=mm&r=g","caption":"zhaowenli"},"sameAs":["https:\/\/x.com\/hx_admin"]}]}},"_links":{"self":[{"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/posts\/2911","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/users\/10"}],"replies":[{"embeddable":true,"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/comments?post=2911"}],"version-history":[{"count":5,"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/posts\/2911\/revisions"}],"predecessor-version":[{"id":3227,"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/posts\/2911\/revisions\/3227"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/media\/2321"}],"wp:attachment":[{"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/media?parent=2911"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/categories?post=2911"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/uetpcb.com\/fr\/wp-json\/wp\/v2\/tags?post=2911"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}