UET cum super 15 annorum experientiam tamquam principalem Typorum Circuitum Tabulam (PCB) fabricam, amplis offerunt capacitatis tabulae emensum impressum, certi sumus omnibus tuis PCB necessariis aequare, variat a prototypis celeriter turnabilibus ad quantitates altas productionis voluminis. .
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Producta- TJNE |
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Seu rigidorum VOL |
Flex |
Rigidum-flex |
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Metal Core |
aluminium Backed |
Halogen-Free PCB |
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Crassitudo aeris PCB |
HDI PCB* |
Aeris Base PCB |
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Latin Features |
Latin |
Advanced |
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Maximum Stratum comitis |
20 |
48 |
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Maximum Panel Location |
500x900mm |
610x1200mm |
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Tegumen Vestigium / Spaceing |
90µm/90µm |
64µm/76µm |
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(1/3oz incipiens foil + platig) |
[0.0035″/0.0035″] | [0.0025″/0.003″] |
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Minimum Mechanica EXERCITATIO Location |
.20mm [0.008″] |
.10mm [0.004″] |
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Minimum Laser EXERCITATIO Location |
.10mm [0.004″] |
.08mm [0.003″] |
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Maxime PCB Rationis aspectum |
10:01 |
25:01 |
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Maximum pondus aeris |
oz 6 |
oz 10 |
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Minimum pondus aeris |
1/3 oz [12µm] |
1/4 oz [9µm] |
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Minimum Core Crassitudo |
50µm [0.002″] |
38µm [0.0015″] |
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Minimum Dielectric Crassitudo |
64µm [0.0025″] |
38µm [0.0015″] |
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Minimum metus Location Plus EXERCITATIO |
0.46mm [0.018″] |
0.4mm [0.016″] |
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Venditor larva Registration |
± 50µm [0.002″] |
± 38µm [0.0015″] |
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Mask Dam minimum Solder |
76µm [0.003″] |
64µm [0.0025″] |
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Aeris Feature ad Edge, V‐cut (30°) |
0.40mm [0.016″] |
0.36mm [0.014″] |
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Aeris Feature ad PCB Edge, fusus |
0.25mm [0.010″] |
0.20mm [0.008″] |
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Tolerantia in Super |
± 100µm [0.004″] |
±50µm [0.002″] |
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HDI Features |
Latin |
Advanced |
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Minimum Microvia foramen Location |
100µm [0.004″] |
75µm [0.003″] |
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Capite metus Location |
0.25mm [0.010″] |
0.20mm [0.008″] |
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Speculum confirmatum Dielectrics |
Y |
Y |
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Maximum aspect ratio |
0.7:1 |
1:01 |
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Reclinant Microvias |
Y |
Y |
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Aeris repleti Microvias |
Y |
Y |
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Sepultus Repleti Vias |
Y |
Y |
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Maximum No. de Buildup Stratis |
II + + N II |
II + + N II |
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superficiem finit |
materials |
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Electroless Nickel immersio Aurum (ENIG) |
FR4 Latin Tg |
Shengyi, ITEQ, KB, Nanya |
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Hot Air Solder Level (HASL, Plumbum et Liberum) |
FR4 Mid Tg |
Shengyi S1000, ITEQ IT158 |
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OSP, immersio plumbi, immersio Argenti, ENEPIG |
FR4 High Tg * |
Shengyi S1000‐2, S1170 |
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Aurum, Mico Aurum, Corpus plenum Aurum durum, Filum Bondabile Aurum |
Halogen Free |
EMC EM285, EM370(D) |
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Electivam et multiplex Superficies finit |
RF Materials |
Rogers RO4350, RO4003 |
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Carbon Atramentum, Peelable SM |
Flexibile Circuit Materias |
Dupont, Panasonic, Taiflex, Shengyi |
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Aluminium Socero PCB |
Shengyi SAR20, Yugu YGA |
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