High-TG PCB Guide
Our High-Tg PCB is designed for high-temperature applications. With a Tg value of 170-180°C, it outperforms standard PCBs. The board stays stable and reliable even in hot environments, making it perfect for demanding electronic projects.
High-TG PCB Technical Specifications
| 分类 | 参数 | 规格 |
|---|---|---|
| Basic Parameters | Glass Transition Temperature | 170-180°C |
| 材料类型 | High-Tg FR-4 | |
| 层数 | 2-32 layers | |
| 板材厚度 | 0.4-3.2mm | |
| 最小线宽/间距 | 3mil/3mil | |
| 电学性能 | 绝缘电阻 | ≥ 10^4 MΩ |
| Dielectric Constant | 4.2-4.8 (1GHz) | |
| Dissipation Factor | ≤ 0.02 (1GHz) | |
| 耐压 | ≥ 1500V | |
| Mechanical Properties | 剥离强度 | ≥ 1.2N/mm |
| Coefficient of Thermal Expansion | X-Y: 12-15 ppm/°C <br> Z: 30-35 ppm/°C | |
| Flexural Strength | ≥ 450 MPa | |
| Water Absorption | ≤ 0.2% | |
| Process Parameters | Minimum Drill Hole | 0.15毫米 |
| 铜的厚度 | 0.5-6oz | |
| 表面处理 | HASL, ENIG, OSP, Immersion Tin | |
| Solder Mask Color | Green, Black, Blue, White, Red | |
| Reliability | Solder Heat Resistance | 288°C, 10s, 3 times |
| Thermal Shock | -65°C ~ +125°C, 1000 cycles | |
| Moisture Resistance | 85°C/85%RH, 1000h | |
| Ion Migration | 85°C/85%RH, 500h |
注：
- All parameters can be adjusted according to customer requirements
- All testing methods comply with IPC standards
- Custom specifications available upon request
Advantages of High-TG PCB
– Maintain stability in high temperature environment
– Effectively prevent board deformation and warping
– Adapt to high-power device applications
– Dimensional stability during welding
– Longer product life
– Low failure rate in harsh environments
– Good dimensional stability
– Low risk of circuit failure
– Stable electrical characteristics
– Good signal integrity
– Low signal loss
– Consistent performance at high temperatures
– Reduced maintenance needs
– Low replacement frequency
– Low failure rate
– High return on investment
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