UET with over 15 years experience， as a leading Printed Circuit Board (PCB) manufacturer, We offer a wide range of printed circuit board capabilities we’re sure will match all of your PCB needs ， varies from fast turnaround prototypes to high volume production quantities.
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Products |
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Rigid |
Flex |
Rigid-Flex |
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Metal Core |
Aluminum Backed |
Halogen-Free PCB |
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Thick Copper PCB |
HDI PCB |
Copper Base PCB |
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Standard Features |
Standard |
Advanced |
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Maximum Layer Count |
20 |
48 |
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Maximum Panel Size |
500x900mm |
610x1200mm |
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Outer Layer Trace/Spacing |
90µm/90µm |
64µm/76µm |
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(1/3oz starting foil + platig) |
[0.0035″/0.0035″] | [0.0025″/0.003″] |
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Minimum Mechancial Drill Size |
.20mm [0.008″] |
.10mm [0.004″] |
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Minimum Laser Drill Size |
.10mm [0.004″] |
.08mm [0.003″] |
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Maximum PCB Aspect Ratio |
10:01 |
25:01 |
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Maximum Copper Weight |
6 oz |
10 oz |
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Minimum Copper Weight |
1/3 oz [12µm] |
1/4 oz [9µm] |
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Minimum Core Thickness |
50µm [0.002″] |
38µm [0.0015″] |
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Minimum Dielectric Thickness |
64µm [0.0025″] |
38µm [0.0015″] |
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Minimum Pad Size Over Drill |
0.46mm [0.018″] |
0.4mm [0.016″] |
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Solder Mask Registration |
± 50µm [0.002″] |
± 38µm [0.0015″] |
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Minimum Solder Mask Dam |
76µm [0.003″] |
64µm [0.0025″] |
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Copper Feature to Edge, V‐cut (30°) |
0.40mm [0.016″] |
0.36mm [0.014″] |
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Copper Feature to PCB Edge, Routed |
0.25mm [0.010″] |
0.20mm [0.008″] |
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Tolerance on Overall |
± 100µm [0.004″] |
±50µm [0.002″] |
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HDI Features |
Standard |
Advanced |
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Minimum Microvia Hole Size |
100µm [0.004″] |
75µm [0.003″] |
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Capture Pad Size |
0.25mm [0.010″] |
0.20mm [0.008″] |
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Glass Reinforced Dielectrics |
Y |
Y |
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Maximum Aspect Ratio |
0.7:1 |
1:01 |
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Stacked Microvias |
Y |
Y |
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Copper Filled Microvias |
Y |
Y |
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Buried Filled Vias |
Y |
Y |
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Maximum No. of Buildup Layers |
3+N+3 |
5+N+5 |
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Surface Finishes |
Materials |
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Electroless Nickel Immersion Gold (ENIG) |
FR4 Standard Tg |
Shengyi, ITEQ, KB, Nanya |
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Hot Air Solder Level (HASL, Lead and Lead‐free) |
FR4 Mid Tg |
Shengyi S1000, ITEQ IT158 |
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OSP, Immersion Tin,Immersion Silver, ENEPIG |
FR4 High Tg |
Shengyi S1000‐2, S1170 |
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Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold |
Halogen Free |
EMC EM285, EM370(D) |
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Selective and Multiple Surface Finishes |
RF Materials |
Rogers RO4350, RO4003 |
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Carbon Ink, Peelable SM |
Flexible Circuit Materials |
Dupont, Panasonic, Taiflex, Shengyi |
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Aluminum Backed PCB |
Shengyi SAR20, Yugu YGA |
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