Multilayer PCBS

Multilayer PCBs are boards with more than 2 layers, including 4, 6, 8, 12… …36 layers. UETPCB’s advanced multilayer pcb manufacturing machines can accept up to 60 layers of production. Polymide, Rogers, metal cores, and many other pressing materials are available for you to choose from. You can send us your files or multilayer pcb design ideas, and we will get back to you as soon as possible with a quote.

Reasons to choose us - Professional multilayer pcb supplier

UETPCB is a professional pcb supplier. We have many years of experience in multilayer pcb manufacturing, perfecting a smooth multilayer pcb manufacturing process from parts procurement to testing, always in compliance with IPC level 3, RoHS, and ISO9001:2008 standards.
If you want to learn more about how we can help you individually, please contact us directly with your questions.

  1. One-stop service: one-stop processing from PCB prototyping to SMT placement
  2. Speedy: fast quotation and quick response
  3. Fast delivery: over 98% on-time delivery rate
  4. High flexibility: various parameters can be customized
  5. Good service: professional customer service, give the best solution
  6. Quality assurance: 100% AOI & E-Testing, CoC provided.
  7. Big offer: PCBA prototyping minimum $50, PCB minimum $5

Start A Quote Now

Multilayer pcb fabrication capability

PCB rigid board Processing Capability
Number of layers 2-60 layers
Typesetting size 800*950
Line width and spacing 2/2MIL
Min Through Hole 0.02MM
Interlayer accuracy 1.5MIL
Min blind hole 0.02MM
PCB thickness 0.05-10.0MM
Surface plating thickness Tin Spray Leaded≥0.25um,Lead free≥1um
OSP 0.2-0.4um
Immersion Ni Gold Ni:2-6um;
Au:1-3uinch;
Immersion silver 5-13uinch
Immersion Tin Tin:≥0.75um
Electroplated hard gold 1-60uinch
Electroplated soft gold Au:0.1-6um
Ni Palladium Gold Ni:2-6um, Pd:1-6um,Au:1-4um
Copper-nickel gold Au:0.02-0.2um, Ni:≥2um
Carbon Oil 5-50um
Green Oil
Blue Gel 0.1-0.8um
Max Aspect Ratio 15:1
Min solder resist bridge 1MIL
Surface finish Leaded Leaded tin spray
Lead free Electroplated copper-nickel-gold, immersion gold, hard gold plating (with/without nickel), spray tin, OSP
Chemical nickel-palladium-gold (with/without nickel), immersion silver, immersion tin
ENIG+C, ENIG+G/F, full plate gold plating +G/F, immersion silver +G/F
Solder Resistance Type Photoimageable ink, etc
Typesetting 0-1.6MM
PCB SMD RF-4, metal base, FPC,

Multilayer pcb manufacturing process

1. Multilayer pcb design

Multilayer pcb design is completed first according to the customer’s needs. PCB design includes the materials used in the multilayer pcb manufacturing process, pcb thickness, etc. We generally use a laser to image the panel directly.

2. Optical inspection

The optical system checks the quality problems of each pcb layer by comparing the actual image on the panel with the PCB design data. Can detect Faults in any layer in time.

3. OXIDE

Oxidation treatment of the inner layers of a multilayer PCB before lamination. It prevents separation between multilayer boards by increasing the roughness of the copper cladding.

4. Lamination

A hydraulic press is used to press the conductive core and glass fiber board together under high pressure and temperature. The lamination time is related to a variety of factors, which we have to consider depending on the material, thickness, etc.

5. Drilling

We need to drill holes in the pcb to facilitate the connection of components and the layers of the board. We are Using advanced multilayer pcb manufacturing machines, will submit the drilling data, and the drillers will find the exact size and location of the holes. The engine automatically detects the tool diameter and the hole slot after drilling. The machine can automatically detect the hole diameter and the hole slot after drilling, which can prevent the hole slot from being skewed or missed and ensure the accuracy of drilling.

6. Immersion of copper plating

In fully automatic copper plating equipment, hole copper and surface copper thickness are much higher than the industry standard.

7. Stripping and etching

After the plating on the panel is completed, we need to remove the residual resist and copper by the SES process. As well as ensuring that the circuit board meets the standard accuracy and quality.

8. Surface treatment

Different surface treatments are chosen according to other materials. The common one is HASL.

9. Electrical testing

After completing the multilayer pcb fabrication, the board is tested electrically with a tester.


Start A Quote Now

9 multi-layer printed circuit board inspection processes

multilayer pcb fabrication
Printed circuit board machine
SPI Solder Past

ROC incoming inspection

Inspection purpose: to eliminate bad manufacturing caused by bad materials on the line

SPI Solder Paste Inspection

Inspection purpose: to detect in advance the work flow from the previous process to the next process
Standard: 3D inspection + statistical analysis of data

AOI inspection

Inspection purpose: to detect whether the product has a reverse leakage, bad material outflow

pcb First Article Inspection
Appearance inspection
Printed circuit board MACHINE

SMT first piece inspection

Inspection purpose: to ensure that the production model and the posted components are fully compatible with the customer’s requirements

Appearance inspection

Inspection purpose: to check whether all processes match with the work instructions on a sample basis

X-RAY-Welding Inspection

Inspection purpose: to detect the original solder joints invisible to the naked eye to avoid false solder short circuit

GPIO test pcb
QA Inspection
PCB PACKAGING

BGA device rework

Inspection purpose: detect BGA soldering defect, disassemble and solder under suitable conditions

QA Inspection

Inspection purpose: to regulate the shipping of finished products, to prevent unqualified products shipped

Out of the warehouse

Anti-static packaging and carton outer packaging ensure safe delivery of products

Start A Quote Now

Multilayer board stackup display

a_4L_pcb
c_6L_pcb_factory
e_8L_pcb_manufacturer

4 layer pcb stackup structure

6 layer pcb stackup structure

8 layer pcb stackup structure

b_4L_stack_up_b
d_6L_stack_up_supplier
f_8L_stack_up_f

4 layer pcb stack up/1.6mm

6 layer pcb stack up/1.6mm

8 layer pcb stack up/1.6mm

Start A Quote Now

Application demonstration of multilayer PCB

PCBA IC programming
multilayer printed circuit board
Printed circuit board

Smart home pcba

Industrial Control PCBA

Medical Electronics PCBA

Medical Electronics PCBA
HASL / Lead Free HASL(Hot Air Solder Levelling)
Automotive Electronics PCBA

Navigation motherboard

Automotive Electronics PCBA

PCBA for security industry

pcba manufacturing
Navigation motherboard
Communication equipment

Industrial control signal processing board

Communication equipment PCBA

Power inverter motherboard

Start A Quote Now

How Many Layers Can A PCB Have?

We support 4-60 layers multilayer pcb fabrication.

Advantages of Multilayer PCB over single and double layer pcb

All of these PCBs are good choices. How you decide to go with a multilayer or single-layer structure depends on what type of product you need to produce. Essentially, if you want to produce complex devices that are small, lightweight, and require high quality, a multilayer PCB may be your best choice. However, if size and weight are not important factors in your product design, a Single or Double Sided PCB design may be more cost effective.

Lighter weight:

Integrating components in a multilayer PCB means less need for connectors and other details, which can provide a lightweight solution for applications. Its can accomplish the same amount of work as multiple single-layer PCBs but smaller. This is because multilayer pcb fabrication require fewer connected components, which reduces weight. This is an essential consideration for smaller electronics where weight is a concern.

Higher assembly density.

Multilayer pcb fabrication allows greater functionality, capacity, and speed with increased thickness.

Smaller size:

In general, a single-layer pcb has a little more area. Because it must increase the surface area of the circuit by increasing its size, it is better suited for use in devices with large volumes and few functions.

Enhanced design features:

Overall, multilayer PCBs outperform typical single-layer PCBs. More controlled impedance characteristics can achieve more substantial EMI shielding and improve overall design quality.

Why Do PCBs Have Multilayer PCB Circuit Board?

Multilayer boards have emerged with the development of the electronics industry. Because there is some advanced equipment, single-sided or double-sided PCB can not meet. Multilayer boards is lighter, smaller, and features higher operation speed than traditional printed circuit boards. All the advantages make them appropriate to be used in high-end electronic equipment like handheld devices, test equipment, heart monitors, etc.

And the preference for multilayer circuit board is still largely dependent on industry trends. Electronics continue to move toward versatility and are small, thin, and lightweight. So single and double sided PCBs can no longer meet the changing needs. And their ability to balance size and functionality has proven limited, but multilayer PCBs offer a comprehensive solution.

While there are several drawbacks to using multilayer boards, such as increased cost, design time, and production investment, these costs are increasingly accepted in today’s world. Functionality is largely favored over price, and people are willing to pay more for high-capacity electronics. In addition, as technology becomes more mainstream, production techniques and machines will eventually become cheaper, especially as new technologies enter the industry.

What Is Multilayer PCBs?

Multilayer PCBs feature three or more layers of conductive copper foil buried in several layers. It is laminated and glued between each layer with a thermally protective insulating layer. It finally appears as a double-sided circuit board with several layers. Multilayer boards have various through-holes for all electrical connections. These types of vias include blind and buried vias and plated vias. This is the simple definition of multilayer boards.

Advantages and Disadvantages of Multilayer PCBs

Compared with single-sided or double-sided PCBs, multilayer boards have higher assembly density, flexibility.

Advantages:

High efficiency: Its enable more advanced design, manufacturing, and assembly techniques. So their inherent electrical characteristics allow them to achieve greater capacity and speed.

High Durability: Its use multiple layers of insulation between circuit layers. They are bonded together using prepreg adhesives and protective materials, making them more durable than standard PCBs.

Smaller size and lighter weight: Its use stacking and lamination techniques, resulting in smaller and lighter weight boards. This is one of its most prominent and highly acclaimed benefits.

Single connection point: Its use a single connection point that can be designed to work together on a board. This particular design simplifies the complex design of electronic devices and reduces size and weight.

Disadvantage:

High cost: Making a multilayer board is much higher than that of a regular pcb. Because multilayer pcb manufacturing machines are very expensive, it is still a relatively new technology.

Narrow application range: Multilayer pcb fabrication requires specialized multilayer pcb manufacturing machines, which not all multilayer pcb suppliers have the funds or need.

Long production time: Each board of a multilayer pcb fabrication requires a lot of time, which leads to more labor costs.