UET with over 15 years experience, as a leading Printed Circuit Board (PCB) manufacturer, We offer a wide range of printed circuit board capabilities we’re sure will match all of your PCB needs , varies from fast turnaround prototypes to high volume production quantities.

Products

Rigid

Flex

Rigid-Flex

Metal Core

Aluminum Backed

Halogen-Free PCB

Thick Copper PCB

HDI PCB

Copper Base PCB

     

Standard Features

Standard

Advanced

Maximum Layer Count

20

48

Maximum Panel Size

500x900mm

610x1200mm

Outer Layer Trace/Spacing

90µm/90µm

64µm/76µm

(1/3oz starting foil + platig)

[0.0035″/0.0035″] [0.0025″/0.003″]

Minimum Mechancial Drill Size

.20mm [0.008″]

.10mm [0.004″]

Minimum Laser Drill Size

.10mm [0.004″]

.08mm [0.003″]

Maximum PCB Aspect Ratio

10:01

25:01

Maximum Copper Weight

6 oz

10 oz

Minimum Copper Weight

1/3 oz [12µm]

1/4 oz [9µm]

Minimum Core Thickness

50µm [0.002″]

38µm [0.0015″]

Minimum Dielectric Thickness

64µm [0.0025″]

38µm [0.0015″]

Minimum Pad Size Over Drill

0.46mm [0.018″]

0.4mm [0.016″]

Solder Mask Registration

± 50µm [0.002″]

± 38µm [0.0015″]

Minimum Solder Mask Dam

76µm [0.003″]

64µm [0.0025″]

Copper Feature to Edge, V‐cut (30°)

0.40mm [0.016″]

0.36mm [0.014″]

Copper Feature to PCB Edge, Routed

0.25mm [0.010″]

0.20mm [0.008″]

Tolerance on Overall

± 100µm [0.004″]

±50µm [0.002″]

     

HDI Features

Standard

Advanced

Minimum Microvia Hole Size

100µm [0.004″]

75µm [0.003″]

Capture Pad Size

0.25mm [0.010″]

0.20mm [0.008″]

Glass Reinforced Dielectrics

Y

Y

Maximum Aspect Ratio

0.7:1

1:01

Stacked Microvias

Y

Y

Copper Filled Microvias

Y

Y

Buried Filled Vias

Y

Y

Maximum No. of Buildup Layers

3+N+3

5+N+5

     

Surface Finishes

Materials

Electroless Nickel Immersion Gold (ENIG)

FR4 Standard Tg

Shengyi, ITEQ, KB, Nanya

Hot Air Solder Level (HASL, Lead and Lead‐free)

FR4 Mid Tg

Shengyi S1000, ITEQ IT158

OSP, Immersion Tin,Immersion Silver, ENEPIG

FR4 High Tg

Shengyi S1000‐2, S1170

Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold

Halogen Free

EMC EM285, EM370(D)

Selective and Multiple Surface Finishes

RF Materials

Rogers RO4350, RO4003

Carbon Ink, Peelable SM

Flexible Circuit Materials

Dupont, Panasonic, Taiflex, Shengyi 

Aluminum Backed PCB

Shengyi SAR20, Yugu YGA