UET with over 15 years experience, as a leading Printed Circuit Board (PCB) manufacturer, We offer a wide range of printed circuit board capabilities we’re sure will match all of your PCB needs , varies from fast turnaround prototypes to high volume production quantities.
Products | ||
Rigid | Flex | Rigid-Flex |
Metal Core | Aluminum Backed | Halogen-Free PCB |
Thick Copper PCB | HDI PCB | Copper Base PCB |
Standard Features | Standard | Advanced |
Maximum Layer Count | 20 | 48 |
Maximum Panel Size | 500x900mm | 610x1200mm |
Outer Layer Trace/Spacing | 90µm/90µm | 64µm/76µm |
(1/3oz starting foil + platig) | [0.0035″/0.0035″] | [0.0025″/0.003″] |
Minimum Mechancial Drill Size | .20mm [0.008″] | .10mm [0.004″] |
Minimum Laser Drill Size | .10mm [0.004″] | .08mm [0.003″] |
Maximum PCB Aspect Ratio | 10:01 | 25:01 |
Maximum Copper Weight | 6 oz | 10 oz |
Minimum Copper Weight | 1/3 oz [12µm] | 1/4 oz [9µm] |
Minimum Core Thickness | 50µm [0.002″] | 38µm [0.0015″] |
Minimum Dielectric Thickness | 64µm [0.0025″] | 38µm [0.0015″] |
Minimum Pad Size Over Drill | 0.46mm [0.018″] | 0.4mm [0.016″] |
Solder Mask Registration | ± 50µm [0.002″] | ± 38µm [0.0015″] |
Minimum Solder Mask Dam | 76µm [0.003″] | 64µm [0.0025″] |
Copper Feature to Edge, V‐cut (30°) | 0.40mm [0.016″] | 0.36mm [0.014″] |
Copper Feature to PCB Edge, Routed | 0.25mm [0.010″] | 0.20mm [0.008″] |
Tolerance on Overall | ± 100µm [0.004″] | ±50µm [0.002″] |
HDI Features | Standard | Advanced |
Minimum Microvia Hole Size | 100µm [0.004″] | 75µm [0.003″] |
Capture Pad Size | 0.25mm [0.010″] | 0.20mm [0.008″] |
Glass Reinforced Dielectrics | Y | Y |
Maximum Aspect Ratio | 0.7:1 | 1:01 |
Stacked Microvias | Y | Y |
Copper Filled Microvias | Y | Y |
Buried Filled Vias | Y | Y |
Maximum No. of Buildup Layers | 3+N+3 | 5+N+5 |
Surface Finishes | Materials | |
Electroless Nickel Immersion Gold (ENIG) | FR4 Standard Tg | Shengyi, ITEQ, KB, Nanya |
Hot Air Solder Level (HASL, Lead and Lead‐free) | FR4 Mid Tg | Shengyi S1000, ITEQ IT158 |
OSP, Immersion Tin,Immersion Silver, ENEPIG | FR4 High Tg | Shengyi S1000‐2, S1170 |
Gold Fingers, Flash Gold, Full Body Hard Gold, Wire Bondable Gold | Halogen Free | EMC EM285, EM370(D) |
Selective and Multiple Surface Finishes | RF Materials | Rogers RO4350, RO4003 |
Carbon Ink, Peelable SM | Flexible Circuit Materials | Dupont, Panasonic, Taiflex, Shengyi |
Aluminum Backed PCB | Shengyi SAR20, Yugu YGA |