HDI PCB Definition

HDI boards are defined as printed circuit boards that pack more circuits into a smaller area compared to standard PCBs. There are several types of HDI boards:

  • 1.type I
  • 2. type II 
  • 3. type III
    Each types with different features as outlined in the IPC-2226 standard.

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HDI for Residential security surveillance system
double sided pcb

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Our HDI PCB Capability

Feature specification
Number of layers 4 – 22 layers standard, 30 layers advanced
Technology  Multilayer PCBs have denser connection pads than standard boards. They include finer lines and spaces. The boards also feature smaller holes and capture pads. This design allows micro vias to penetrate select layers and integrate into surface pads
HDI builds 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer / ELIC, Ultra HDI in R&D
Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished) 18μm – 70μm
Minimum track and gap 0.075mm / 0.075mm
PCB thickness 0.40mm – 10.0mm
Maxmimum dimensions 800mm x 950mm; dependant upon laser drilling machine
Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill 0.15mm
Minimum laser drill 0.10mm standard, 0.075mm advanced

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HDI PCB Design

The process of HDI PCB design consists of these main steps:

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Our HDI PCB Technology

HDI technology is a high-end technology used to manufacture HDI PCBs. This printed circuit board features high density and exemplary performance in circuit interconnection.

According to the vias, HDI boards can be divided into six different types:

  • ⚫ Face-to-face through vias
  • ⚫ Through vias and buried vias
  • ⚫ Two or more layers with through vias
  • ⚫ Non-electrical connection and passive substrate
  • ⚫ Coreless construction with layer pairs
  • ⚫ Alternate constructions of coreless constructions with layer pairs
  • ⚫ HDI Printed Circuit Board Manufacturing

Advanced HDI Technology Methods

  1. Via in-pad process:
    In this process, HDI PCB manufacturers place bias on the surface of the flat lands. Then, they fill the vias with conductive or non-conductive epoxy. Later, they are capped and plated over, making the via invisible.
  2. Via fill technology:
    Specific materials include silver-filled, conductive epoxy, non-conductive epoxy, electrochemical plating, and copper-filled.
  3. Non-conventional HDI PCB building:
    HDI PCBs must combine more lines and annular rings on a thin, high-density board.
  4. Laser drill technology:
    A laser beam 20 microns in diameter can create the smallest vias on the surface of HDI PCBs. This high-energy light is precise and efficient and can cut through metal and glass to make a tiny hole.

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HDI PCB Application & Advantages

Though HDI PCB has a complex manufacturing process, it has a wide range of applications. It can be used in various industries, such as electronics and medical. The lighter weight and small size give it appropriate reasons to be installed in miniature equipment.

HDI PCB is consumer-driven and fit for more delicate and sophisticated electronic equipment. Nowadays, people prefer agility electronic equipment because of its convenience and lightweight. HDI PCB makes the equipment small and smart. It is thin, light, and features high-end technology and high-speed operation capability.

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Your Reliable HDI PCB Manufacturing

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