High-TG PCB Guide

Our High-Tg PCB is designed for high-temperature applications. With a Tg value of 170-180°C, it outperforms standard PCBs. The board stays stable and reliable even in hot environments, making it perfect for demanding electronic projects.

High_TG_PCB

High-TG PCB Technical Specifications

Category Parameter Specification
Basic Parameters Glass Transition Temperature 170-180°C
  Material Type High-Tg FR-4
  Layer Count 2-32 layers
  Board Thickness 0.4-3.2mm
  Min Line Width/Spacing 3mil/3mil
Electrical Properties Insulation Resistance ≥ 10^4 MΩ
  Dielectric Constant 4.2-4.8 (1GHz)
  Dissipation Factor ≤ 0.02 (1GHz)
  Withstanding Voltage ≥ 1500V
Mechanical Properties Peel Strength ≥ 1.2N/mm
  Coefficient of Thermal Expansion X-Y: 12-15 ppm/°C <br> Z: 30-35 ppm/°C
  Flexural Strength ≥ 450 MPa
  Water Absorption ≤ 0.2%
Process Parameters Minimum Drill Hole 0.15mm
  Copper Thickness 0.5-6oz
  Surface Finish HASL, ENIG, OSP, Immersion Tin
  Solder Mask Color Green, Black, Blue, White, Red
Reliability Solder Heat Resistance 288°C, 10s, 3 times
  Thermal Shock -65°C ~ +125°C, 1000 cycles
  Moisture Resistance 85°C/85%RH, 1000h
  Ion Migration 85°C/85%RH, 500h

Notes:

  1. All parameters can be adjusted according to customer requirements
  2. All testing methods comply with IPC standards
  3. Custom specifications available upon request

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Advantages of High-TG PCB

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Applications of High-TG PCB

High_TG_Automotive_Industry

Automotive Industry

High_TGIndustrial_Applications

Industrial Applications

High_TG_Telecommunications

Telecommunications

High_TGConsumer_Electronics

Consumer Electronics

High_TG_Aerospace

Aerospace Applications

High_TG_Medical_Equipment

Medical Equipment

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