High-TG PCB Guide
Our High-Tg PCB is designed for high-temperature applications. With a Tg value of 170-180°C, it outperforms standard PCBs. The board stays stable and reliable even in hot environments, making it perfect for demanding electronic projects.
High-TG PCB Technical Specifications
Category | Parameter | Specification |
---|---|---|
Basic Parameters | Glass Transition Temperature | 170-180°C |
Material Type | High-Tg FR-4 | |
Layer Count | 2-32 layers | |
Board Thickness | 0.4-3.2mm | |
Min Line Width/Spacing | 3mil/3mil | |
Electrical Properties | Insulation Resistance | ≥ 10^4 MΩ |
Dielectric Constant | 4.2-4.8 (1GHz) | |
Dissipation Factor | ≤ 0.02 (1GHz) | |
Withstanding Voltage | ≥ 1500V | |
Mechanical Properties | Peel Strength | ≥ 1.2N/mm |
Coefficient of Thermal Expansion | X-Y: 12-15 ppm/°C <br> Z: 30-35 ppm/°C | |
Flexural Strength | ≥ 450 MPa | |
Water Absorption | ≤ 0.2% | |
Process Parameters | Minimum Drill Hole | 0.15mm |
Copper Thickness | 0.5-6oz | |
Surface Finish | HASL, ENIG, OSP, Immersion Tin | |
Solder Mask Color | Green, Black, Blue, White, Red | |
Reliability | Solder Heat Resistance | 288°C, 10s, 3 times |
Thermal Shock | -65°C ~ +125°C, 1000 cycles | |
Moisture Resistance | 85°C/85%RH, 1000h | |
Ion Migration | 85°C/85%RH, 500h |
Notes:
- All parameters can be adjusted according to customer requirements
- All testing methods comply with IPC standards
- Custom specifications available upon request
Advantages of High-TG PCB
– Maintain stability in high temperature environment
– Effectively prevent board deformation and warping
– Adapt to high-power device applications
– Dimensional stability during welding
– Longer product life
– Low failure rate in harsh environments
– Good dimensional stability
– Low risk of circuit failure
– Stable electrical characteristics
– Good signal integrity
– Low signal loss
– Consistent performance at high temperatures
– Reduced maintenance needs
– Low replacement frequency
– Low failure rate
– High return on investment
Applications of High-TG PCB
Automotive Industry
Industrial Applications
Telecommunications
Consumer Electronics
Aerospace Applications
Medical Equipment
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