High-TG PCB Guide

Our High-Tg PCB is designed for high-temperature applications. With a Tg value of 170-180°C, it outperforms standard PCBs. The board stays stable and reliable even in hot environments, making it perfect for demanding electronic projects.

High_TG_PCB

High-TG PCB Technical Specifications

Category Parameter Specification
Basic Parameters Glass Transition Temperature 170-180°C
  Material Type High-Tg FR-4
  Layer Count 2-32 layers
  Board Thickness 0.4-3.2mm
  Min Line Width/Spacing 3mil/3mil
Electrical Properties Insulation Resistance ≥ 10^4 MΩ
  Dielectric Constant 4.2-4.8 (1GHz)
  Dissipation Factor ≤ 0.02 (1GHz)
  Withstanding Voltage ≥ 1500V
Mechanical Properties Peel Strength ≥ 1.2N/mm
  Coefficient of Thermal Expansion X-Y: 12-15 ppm/°C <br> Z: 30-35 ppm/°C
  Flexural Strength ≥ 450 MPa
  Water Absorption ≤ 0.2%
Process Parameters Minimum Drill Hole 0.15mm
  Copper Thickness 0.5-6oz
  Surface Finish HASL, ENIG, OSP, Immersion Tin
  Solder Mask Color Green, Black, Blue, White, Red
Reliability Solder Heat Resistance 288°C, 10s, 3 times
  Thermal Shock -65°C ~ +125°C, 1000 cycles
  Moisture Resistance 85°C/85%RH, 1000h
  Ion Migration 85°C/85%RH, 500h

Notes:

  1. All parameters can be adjusted according to customer requirements
  2. All testing methods comply with IPC standards
  3. Custom specifications available upon request

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Advantages of High-TG PCB

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Applications of High-TG PCB

High_TG_Automotive_Industry

Automotive Industry

High_TGIndustrial_Applications

Industrial Applications

High_TG_Telecommunications

Telecommunications

High_TGConsumer_Electronics

Consumer Electronics

High_TG_Aerospace

Aerospace Applications

High_TG_Medical_Equipment

Medical Equipment

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To better understand our products and services, feel free to contact our customer service team at any time. We look forward to establishing contact with you, solving your needs, and creating wonderful cooperation opportunities together!


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